생성 날짜 2024.06.20

WINBOND

Winbond Electronics Corp. Founded in September 1987 in Hsinchu Science Park, Winbond was officially listed on the Taiwan Stock Exchange in 1995. In July 2008, the headquarters moved to the Central Taiwan Science Park. The 12-inch wafer fab is the main R&D and production base. The process technology of the products covers the range of 0.11μm~70nm. Today, Winbond is committed to the production and design of memory products, including the "DRAM Product Business Group", "Memory IC Manufacturing Business Group" and "Flash Memory IC Business Group".

We collaborate with renowned brands to offer flexible ordering with no minimum quantities and competitive pricing. Explore our one-stop shopping experience where you can conveniently find a wide range of products tailored to your needs. 