SMT Project | Capability |
Maximum PCB Size | 310mm x 410mm (SMT) |
Maximum PCB Thickness | 3mm |
Minimum PCB Thickness | 0.5mm |
Smallest Chip Component | 0201 package or components larger than 0.6mm x 0.3mm |
Maximum Component Weight | 150 grams |
Maximum Component Height | 25mm |
Maximum Component Size | 150mm x 150mm |
Smallest Pin Pitch | 0.3mm |
Smallest Ball Grid Array (BGA) Pitch | 0.3mm |
Smallest BGA Ball Diameter | 0.3mm |
Maximum Component Placement Accuracy (100QFP) | 25µm @ IPC |
Placement Capacity | 3-4 million points per day |
TAIWEIXINNUO Technology Co., Ltd.
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1205,12th Floor, Dingcheng International,No.7 Zhonghang Road, Futian District,Shenzhen
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